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FPC(FlexiblePrintedCircuit, FPC)

FPC(FlexiblePrintedCircuit, FPC)

Tsanangudzo Pfupi

Flexible yakadhindwa redunhu bhodhi (FlexiblePrinted Circuit, FPC), inozivikanwawo se flexible circuit board, flexible circuit board, inofarirwa nehuremu hwayo, hutete hwakatsetseka, kukotama kwemahara uye kupeta uye humwe hunhu hwakanaka…, asi kuongororwa kwemhando yemumba kweFPC ndiko zvichiri Kunyanya kuvimba nekuongorora kwekuona kwemaoko, kudhura kwakanyanya uye kushanda kwakaderera.Nekukurumidza kusimudzira kweindasitiri yemagetsi, dhizaini yedhizaini iri kuramba ichiwedzera-chaiyo uye yakakwirira-density.Nzira dzechinyakare dzekuongorora dzemanyorero hadzichakwanise kuzadzisa zvinodiwa zvekugadzira.FPC defect otomatiki kuona yave isingadzivisike maitiro ekusimudzira maindasitiri.


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FPC tsananguro yechigadzirwa

Flexible circuit (FPC) itekinoroji yakagadziridzwa neUnited States yekuvandudza tekinoroji yeroketi muma1970s.Yakagadzirwa nepolyester firimu kana polyimide se substrate ine kuvimbika kwepamusoro uye kuchinjika kwakanakisa.Nekuisa dhizaini redhizaini papepa repurasitiki rakatetepa uye rakareruka rinogona kupetwa, nhamba huru yezvikamu zvakarongeka zvakaturikidzana munzvimbo yakamanikana uye isina kukwana kuti iite inobhenda inochinjika sedunhu.Rudzi urwu rwedunhu runogona kukotama pamadiro, kupetwa, huremu huremu, saizi diki, yakanaka kupisa kupisa, kuisirwa nyore, uye kupaza kuburikidza neiyo yechinyakare yekubatanidza tekinoroji.Muchigadziro chedunhu rinoshanduka, zvigadzirwa zviri insulating firimu, conductor uye adhesive.

Basic structure

Copper Film

Copper foil: yakakamurwa kuita electrolytic mhangura uye yakakungurutswa mhangura.Ukobvu hwakajairika i1oz 1/2oz uye 1/3 oz

Substrate firimu: Kune maviri akajairwa makobvu: 1mil uye 1/2mil.

Glue (adhesive): Ukobvu hunotemerwa zvinoenderana nezvinodiwa nemutengi.

Kavha Firimu

Ivhara firimu rekudzivirira firimu: rekuvhara pamusoro.Ukobvu hwakajairika i1mil uye 1/2mil.

Glue (adhesive): Ukobvu hunotemerwa zvinoenderana nezvinodiwa nemutengi.

Bepa rekuburitsa: dzivirira iyo inonamira kune yekunze zvinhu usati wadzvanya;nyore kushanda.

Firimu reStiffener (PI Stiffener Firimu)

Reinforcement board: Simbisa iyo mechanic simba reFPC, iri nyore kune pamusoro pekuisa mashandiro.Ukobvu hwakajairika i3mil kusvika 9mil.

Glue (adhesive): Ukobvu hunotemerwa zvinoenderana nezvinodiwa nemutengi.

Bepa rekuburitsa: dzivirira chinonamira kuchinhu chekunze usati wadzvanya.

EMI: Electromagnetic shielding firimu kuchengetedza dunhu mukati redunhu bhodhi kubva kunze kwekukanganisa (yakasimba magetsi emagetsi nzvimbo kana inotapukirwa nekukanganisa nzvimbo).

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